eMCP(ePOP)
High-density eMCP is a combination of 3D V4 256Gb NAND flash-based 128GB eMMC5.1 and 1xnm 8Gb DRAM-based 6GB LPDDR4X, packaged into an area-efficient design with stable functionality. The package fits neatly inside a range of compact devices where portability and mobility are crucial, especially in smartphones, wearables, and connected IoT devices.
|
Description |
Brand |
capacity |
|
eMMC5.1+LPDDR4X |
SAMSUNG |
2-512GB +2-96GB |
|
eMMC5.1+LPDDR4X |
SK Hynix |
16-128GB + 2-6GB |
|
eMMC5.1+LPDDR4X |
HOSIN GLOBAL |
32GB+2GB |
Application area
